| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/
. Solder joint strength is based upon many things, such as size of pad/land, amount of solder, excursion through the thermal zone, plating integrity of the component and the board, etc
| https://www.eptac.com/faqs/ask-helena-leo/ask/darkened-smt-capacitor-or-resistor-terminations-after-leadfree-soldering-reflow
: Lately some of our terminations on SMT caps and resistors look dark, almost purple, like they have been overheated during the reflow process in a lead free environment
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
) and its compounds in some of their manufacturing operations, such as solder plating. This article aims to provide the reader some basic background information on the semiconductor industry's "lead-free" (Pb-free) initiatives
| https://www.eptac.com/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components/
. Solder joint strength is based upon many things, such as size of pad/land, amount of solder, excursion through the thermal zone, plating integrity of the component and the board, etc
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components
. Solder joint strength is based upon many things, such as size of pad/land, amount of solder, excursion through the thermal zone, plating integrity of the component and the board, etc
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
) and its compounds in some of their manufacturing operations, such as solder plating. This article aims to provide the reader some basic background information on the semiconductor industry's "lead-free" (Pb-free) initiatives
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
) and its compounds in some of their manufacturing operations, such as solder plating. This article aims to provide the reader some basic background information on the semiconductor industry's "lead-free" (Pb-free) initiatives
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