20 plating flex circuits with enig cracking results

. Original circuits were HASL, new products have ENIG Question: •  Will this create any gold embrittlement with the use of ENIG? 2 Question #1 •  From IPC 6012 Table 3-2 Final Finish and Coating Requirements, the parameters for ENIG coating is as shown

| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf

. Original circuits were HASL, new products have ENIG Question: •  Will this create any gold embrittlement with the use of ENIG? 2 Question #1 •  From IPC 6012 Table 3-2 Final Finish and Coating Requirements, the parameters for ENIG coating is as shown

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf

? 2 Gold Plating vs Gold Flash Question: J-STD-001 section 4.5.1 requires gold removal for through-hole component leads with gold thickness more than 2.54micrometer

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

Understanding the PCB Fabrication Process: From Design to Delivery

Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/

. These sheets are electrically isolated from each other with a layer of non-conductive substrate. PCBs are faster and easier to fabricate than earlier mass-producing circuits since fabricators can mount and wire components in a single operation

Imagineering, Inc.

Developed Copper Electroplating Process for BMV Filling with the Special Feature of a Very Bright Cu Deposition on Flex and Flex-Rigid PCB Applications John Foley, Mustafa Özkök, Dipl. -Ing., Peter Haack, Ph.D., Vera Peldinski, Dipl.-Ing., Thomas Huelsmann

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

Developed Copper Electroplating Process for BMV Filling with the Special Feature of a Very Bright Cu Deposition on Flex and Flex-Rigid PCB Applications John Foley, Mustafa Özkök, Dipl. -Ing., Peter Haack, Ph.D., Vera Peldinski, Dipl.-Ing., Thomas Huelsmann

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

. tensile strength, melting temperatures).   Area Array Package A surface-mount component with a grid of connection points on the bottom

ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

plating.   Popcorning A term used to describe the effect of water turning into steam inside electrical components during reflow. The pressure caused by the steam can crack the components with some cracks being so severe they propagate to the exterior

ASYMTEK Products | Nordson Electronics Solutions

Webinars

Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/

ranges from simple two layer prototypes through complex multi-layer HDI and micro HDI technology PCBs where the structures ranged from rigid, flex, rigid-flex, and hybrids, with circuits containing analog, digital, RF, mixed signal, high speed, high power

Surface Mount Technology Association (SMTA)

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

ranges from simple two layer prototypes through complex multi-layer HDI and micro HDI technology PCBs where the structures ranged from rigid, flex, rigid-flex, and hybrids, with circuits containing analog, digital, RF, mixed signal, high speed, high power

Surface Mount Technology Association (SMTA)