ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
: PEM-INST-001 ESA/SCC Spec No.25200 Ceramic Chip Capacitors Discoidals, Filters, MLCCs, etc. Mil-PRF-123, 31033 & 49470 Die Attach Mil-STD-883
| https://www.eptac.com/ask/smt-polyphenylene-sulfide-pps-film-capacitors-and-defects/
) when heated like ceramic chips if cracked horizontal, or is it considered a defect for all three classes? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
| https://www.eptac.com/ask/ipc-a-610-acceptable-requirements-for-nicks-and-chip-outs/
: In IPC-A-610 section 9.4 on page 9-8 component damage there seems to be a lack of class three acceptable requirements for nicks or chip-outs in ceramic bodied components that are not in the termination area
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