FKN Systek | http://fknsystek.com/Tools%20for%20Assembly.htm
. Insert the hook into the cut-outs on the PLCC, squeeze the grips together, and the PLCC will be safely pulled from the socket. I 99-0004 IC Lead Straightener Suitable for MOS and CMOS components from 4 to 48 pins
FKN Systek | https://fknsystek.com/Tools%20for%20Assembly.htm
. Insert the hook into the cut-outs on the PLCC, squeeze the grips together, and the PLCC will be safely pulled from the socket. I 99-0004 IC Lead Straightener Suitable for MOS and CMOS components from 4 to 48 pins
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=12
: Automotive and Transportation UNDERFILL VOIDS Nordson SONOSCAN Flip Chip Underfill Void - Application Note 2271 LEAD DELAMINATIONS Nordson SONOSCAN PLCC Lead Delaminations - Application Note 1058
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: Medical, Life Science and Pharmaceutical LEAD DELAMINATIONS Nordson SONOSCAN PLCC Lead Delaminations - Application Note 1058 SECTIONED 3D AMI Nordson SONOSCAN Smart Card 3D Acoustic Microscope Image
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=12
Sonoscan Leadership Company History Locations Patent List News Events Careers Test and Inspection Products Content Your results for: Test and Inspection UNDERFILL VOIDS Nordson SONOSCAN Flip Chip Underfill Void - Application Note 2271 LEAD DELAMINATIONS Nordson SONOSCAN PLCC Lead Delaminations - Application Note 1058 SECTIONED 3D
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=12
Flip Chip Underfill Void - Application Note 2271 LEAD DELAMINATIONS Nordson SONOSCAN PLCC Lead Delaminations - Application Note 1058 SECTIONED 3D AMI Nordson SONOSCAN Smart Card 3D Acoustic Microscope
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=11
Flip Chip Underfill Void - Application Note 2271 LEAD DELAMINATIONS Nordson SONOSCAN PLCC Lead Delaminations - Application Note 1058 First
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