KingFei SMT Tech | https://www.smtspare-parts.com/sale-14752743-nozzle-aa05703-h08-h12-0-7-nozzle-for-fuji-nxt-machine-ceramic-tip.html
/ 1.7 ABHPN - 8590 QP-L-47 NZ. Ø 7.0 Issues related to improper nozzle/feeder maintenance or use of poor quality nozzles are often the same
KingFei SMT Tech | https://www.smtspare-parts.com/sale-8536579-fuji-nxt-h01-smt-nozzle-7-0-aa08000-original-new-for-fuji-smt-machine.html
/ 1.7 ABHPN - 8590 QP-L-47 NZ. Ø 7.0 Issues related to improper nozzle/feeder maintenance or use of poor quality nozzles are often the same
KingFei SMT Tech | http://www.smtspare-parts.com/news/how-to-choose-nozzles-for-your-juki-machine-82623.html
." If you manually select the nozzle, select the nozzle with extreme care to prevent poor pickup and placement of a compornent, The nozzle numbers for major types of components to placed be are shown in Table 1.4.2
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pcb-via-terms-and-applications_topic1596_post6956.html
. A common application for this is on a BGA design where vias are commonly found in very close proximity to the BGA’s SMD pads. The concern is during assembly, solder will wick away from the intended pad and flow down the via creating poor or non-existent solder joints. Via Filling
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems?con=t&page=2
factors causing poor adhesion Nordson MARCH Announces a New Trial Program for Plasma Systems Used to Improve Adhesion and Uniformity during Manufacturing Operations Nordson MARCH Now
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/selective-vs-wave-soldering
), surface mount technology (SMT), and mixed assemblies to circuit boards. The major downside of wave soldering is the limited ability to define process parameters, which leads to poor solder joint quality and diminished product reliability
Heller Industries Inc. | https://hellerindustries.com/award/2021-soldering-equipment-service-excellence-award/
. Greatly Appreciated! ” commented Marc Peo. Customers of the Service Excellence Awards participants rate each company on a scale of 1 (poor) to 7 (best in class
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1286&OB=ASC.html
2007.0 do not support these pad shapes, but these results are pretty bad. The pad shape is manually created with poor resolution, along with the expanded solder mask shape
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1596&OB=ASC.html
. A common application for this is on a BGA design where vias are commonly found in very close proximity to the BGA’s SMD pads. The concern is during assembly, solder will wick away from the intended pad and flow down the via creating poor or non-existent solder joints. Via Filling
Heller Industries Inc. | https://hellerindustries.com/award/2021-soldering-equipment-service-excellence-award
. Greatly Appreciated! ” commented Marc Peo. Customers of the Service Excellence Awards participants rate each company on a scale of 1 (poor) to 7 (best in class
