| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print
. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. Many of us would agree that we are still facing challenges on one of the common defects – poor barrel fill. The problem is confounded with currently High density/Multilayer thick PCB and applying Lead-free soldering
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-via-terms-and-applications_topic1596.xml
. A common application for this is on a BGA design where vias are commonly found in very close proximity to the BGA’s SMD pads. The concern is during assembly, solder will wick away from the intended pad and flow down the via creating poor or non-existent solder joints. Via Filling
| http://etasmt.com/te_news_bulletin/2019-12-17/13161.chtml
. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pcb-via-terms-and-applications_topic1596_post6956.html
. A common application for this is on a BGA design where vias are commonly found in very close proximity to the BGA’s SMD pads. The concern is during assembly, solder will wick away from the intended pad and flow down the via creating poor or non-existent solder joints. Via Filling
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1596&OB=ASC.html
. A common application for this is on a BGA design where vias are commonly found in very close proximity to the BGA’s SMD pads. The concern is during assembly, solder will wick away from the intended pad and flow down the via creating poor or non-existent solder joints. Via Filling
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/upsize-or-downsize
. This situation will result in poor homogenization of the melt pool, which will lead to poor part quality. When the injection unit is too large, the travel of the screw needed to fill the mold is also very short, sometimes not allowing the machine hydraulics and electronics to be utilized effectively
Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
: Non-coplanar leads on the component Excessive warpage of the PCB or substrate Poor wetting Insufficient amount of solder due to improper printing parameters Skips in the printed solder due to blocked
Imagineering, Inc. | https://www.pcbnet.com/blog/when-to-use-x-ray-inspection-in-pcbs/
. Solder voids may cause boards to malfunction due to poor heat conductivity. X-rays are one of the easiest ways for manufacturers to spot solder voids. Solder Bridges
