KingFei SMT Tech | http://www.smtspare-parts.com/news/how-to-choose-nozzles-for-your-juki-machine-82623.html
." If you manually select the nozzle, select the nozzle with extreme care to prevent poor pickup and placement of a compornent, The nozzle numbers for major types of components to placed be are shown in Table 1.4.2
KingFei SMT Tech | https://www.smtspare-parts.com/news/how-to-choose-nozzles-for-your-juki-machine-82623.html
（2） Nozzle Selection The Nozzle can be automatically recognized if you follow the explanation of " ATC Nozzle Selection." If you manually select the nozzle, select the nozzle with extreme care to prevent poor pickup and placement of a compornent, The nozzle numbers for major types of components to placed be are shown in Table 1.4.2
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: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. In addition, if the viscosity of the solder paste is too low, and the solder paste slump is relatively poor, it is also a solder paste quality problem. (2
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Pre-reflow factors that can cause HIP include insufficient paste, bad placement, contamination/ oxidization (during handling or storage
| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
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and PCB Handling Machine etc. More details, please contact us: Tel: +86 13670124230 ( WhatsApp /Skype/WeChat) Email: etaSMT@foxmail.com What if after the assembly of the prototype, the product exhibited electrical failure due to material problem or because of poor assembly, another cycle of evaluation run ensued until it achieved
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
What Are Reflow Soldering Defects - Heller Home » What Are Reflow Soldering Defects Reflow Soldering Defects & Causes DEFECT / CAUSE RELATIONSHIP Coplanarity Contamination Metallurgy Solder Quality Solder Volume Reflow Profile Placement Accuracy Land Design Reflow Cycle Too Long Excessive Reflow Temp
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/questions-answers_forum34&SO=T&OB=desc_page11.html
:38am 3 356 By Nick B 13 Apr 2017 at 11:06am Poor perfomance from the UK By acmenet , 07 Oct 2020 at 4:32am 7 520 By Nick B 12 Oct 2020 at 8
