| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. The plating thickness is too thin or the result of poor processing, which can be easily damaged during assembly; The soldering temperature is not high enough
Blackfox Training Institute, LLC | https://www.blackfox.com/how-to-remove-oxidation-from-soldering-iron-tips/
: Home Blog How To Remove Oxidation From… Mar 8 2021 Blog News & Events Soldering Poor soldering tip maintenance is a common culprit in most soldering issues
Imagineering, Inc. | https://www.pcbnet.com/blog/material-choices-for-high-speed-flexible-circuits/
. Flexible circuits are handy, but the most significant problem they present is poor performance in high-speed applications. For this reason, PCB designs that incorporate this type of technology sometimes have to be creative in the application of flexible circuits
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/how-to-remove-oxidation-from-soldering-iron-tips/
Oxidation From Soldering Iron Tips Poor soldering tip maintenance is a common culprit in most soldering issues. Most of which is caused by a heavy buildup of oxidation on the soldering iron tip’s surface
ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/394.html
(including the rugged Mark points),applicable for tin plating, coppering,gold plating,FPC and other types of PCB with different colors. 3. Cleaning system:dry cleaning,wet cleaning,vacuum,which can be combined to use cleaning system, a new type of wipes to ensure full contact with the steel mesh, increase the type of vacuum suction to ensure the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/screw-materials
. These materials have relatively poor strength and abrasion resistance. They cannot be flame hardened and must have the flights hard surface welded
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. Plating and lithography techniques can be used during front end manufacture to build bump and pillar structures. In addition, solder balls may also be placed or printed and then reflowed during back end manufacture before wafer dicing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
