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How to Prevent Non-Wetting Defect during the SMT Reflow Process-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
: T, S, C, A Atmosphere: Nitrogen Temperature:240°C Large Unacceptable Void – Likely Due to Bad Wetting (Lead Free HASL Candidate
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
: T, S, C, A Atmosphere: Nitrogen Temperature:240°C Large Unacceptable Void – Likely Due to Bad Wetting (Lead Free HASL Candidate
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_wave-soldering-sot23_topic995.xml
. All this information is important to us. Poor Wetting can be caused by contamination of the solder or improper solder temperature or conveyor belt moving too fast.  
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. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic995&OB=ASC.html
. Now we have the problem of poor wetting. The wave soldering diection is correct. My question is also is there difference between reflow soldering footprint and the wave soldering footprint
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: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
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– ramp up too fast Same as soldering ball. Poor wetting – ramp up too slow Solder paste is oxidizing if the pre-heat too long. Pre-heat and soak zone (from 150°C to 180°C
| http://etasmt.com/te_news_bulletin/2019-12-17/13161.chtml
. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill