PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
. The Lead-Frame Thickness on a common DPAK is 0.65 mm but the Lead Thickness on a 0.50 mm pitch QFP or SOP is 0.15 mm. They do not require the same Toe value PCB Libraries, Inc
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
. The Lead-Frame Thickness on a common DPAK is 0.65 mm but the Lead Thickness on a 0.50 mm pitch QFP or SOP is 0.15 mm. They do not require the same Toe value PCB Libraries, Inc
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.html
. The Lead-Frame Thickness on a common DPAK is 0.65 mm but the Lead Thickness on a 0.50 mm pitch QFP or SOP is 0.15 mm. They do not require the same Toe value PCB Libraries, Inc
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.xml
;However, the FED in Germany did pick up the Proportional Pad Stack model and published a book on it by Rainer Taube. IPC-J-STD-001 Gull Wing Leads and Solder Joints
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2587&OB=DESC.html
. The Lead-Frame Thickness on a common DPAK is 0.65 mm but the Lead Thickness on a 0.50 mm pitch QFP or SOP is 0.15 mm. They do not require the same Toe value PCB Libraries, Inc
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2587&OB=ASC.html
. The Lead-Frame Thickness on a common DPAK is 0.65 mm but the Lead Thickness on a 0.50 mm pitch QFP or SOP is 0.15 mm. They do not require the same Toe value PCB Libraries, Inc
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_wave-soldering-sot23_topic995.xml
. All this information is important to us. Poor Wetting can be caused by contamination of the solder or improper solder temperature or conveyor belt moving too fast.  
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Material:T, S, C, A Atmosphere:Nitrogen Temperature:230°C Excellent Wetting, Reduced Temperature Shows No Effect on Joint Formation 20 mil QFP Lead PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 20 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 12 Material
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
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Phone: (770) 538-0411