ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. This is particularly important if your boards feature BGA devices, QFNs, plated through holes or PTH through hole components. Ruby XL allows inspection of large backplane boards used in servers and for 5G
Lewis & Clark | http://www.lewis-clark.com/product/ok-international-metcal-apr-5000-array-package-rework-sttion/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Capillary Underfill Capillary Underfill Dispensing Typically Used for Silicon Die or BGA Applications in High Shock Environments or When Consistent Reliability is Required The Capillary Underfill
GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Capillary Underfill Capillary Underfill Dispensing Typically Used for Silicon Die or BGA Applications in High Shock Environments or When Consistent Reliability is Required The Capillary Underfill
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Capillary Underfill Capillary Underfill Dispensing Typically Used for Silicon Die or BGA Applications in High Shock Environments or When Consistent Reliability is Required The Capillary Underfill
Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/
. We handle the whole process including ordering the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts
Lewis & Clark | http://www.lewis-clark.com/product-tag/rework-station/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/library-expert-2015-20-released_topic1808_post7406.html
!! FIXED / ENHANCED: Calculator: Non-collapsing Ball BGA component family was not saving the Ball Style data correctly The Extended Footprint Name for parts with square Thermal Tabs was updated to a single number PADS TO CAD
| https://www.wesource.com/rework-systems-and-accessories/?p=catalog&mode=catalog&parent=23&pg=1&CatalogSetSortBy=price
Rework System MX-500P ID_700221 (4/23) Price: $299.00 Mini Micro Stencil BGA Re-Balling Station_ID 140207 Price: $2,450.00 AirVac PBCRM 12 or 15 Pre-Heater Rework Station_ID 111622 Call for price Martin Dot-Liner-06 with Dispense Technic ID_53828 (4/22) JG Price
ASCEN Technology | https://www.ascen.ltd/Blog/machine/PCB_conveyor/list_34_3.html
feeder PCB assembly equipment ASCEN equipment manual list PCB Depaneling Operate Manual Face mask making machine Mask making machine manual Dealer cooperation ASCEN Cooperation Pre-sale Service
