Partner Websites: pre-bake standard for bga rework (Page 6 of 22)

Wenesco 6x6 Hot Plate with Chromalox 1600 Controller ID_60293: World Equipment Source

| https://www.wesource.com/rework-systems-and-accessories/wenesco-6x6-hot-plate-with-chromalox-1600-controller-id-60293/

: used for horn outputs. Output 2 can be reset before the condition resets. Asset# 60293 LOC: TBD Cart Shelf 06_19_2020 - RMW Products You May Like AirVac PBCRM 12 or 15 Pre-Heater Rework Station_ID 111622 Call for price Hakko 852 SMD Rework Station ID_60487 Price

Moisture Sensitive Devices (MSD) Council

Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm

. The maximum acceptable moisture content and the rate of moisture diffusion vary for each package. To provide suitable guidelines for assembly, the component manufacturers must categorize each new device based on how long it takes to absorb a critical level of moisture in a standard production environment

Surface Mount Technology Association (SMTA)

Capillary Underfill Dispensing PCD

GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-pcdforunderfill.php

. Operator rework and scrap will be eliminated. A typical system for underfill is configured with these additional options: Standalone: PCD4 with S Type Tips Process Calibration System Heated work area

GPD Global

Capillary Underfill Dispensing PCD

GPD Global | https://www.gpd-global.com/pcdpumpseries-pcdforunderfill.php

. Operator rework and scrap will be eliminated. A typical system for underfill is configured with these additional options: Standalone: PCD4 with S Type Tips Process Calibration System Heated work area

GPD Global

Capillary Underfill Dispensing PCD

GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing-pcd.php

. Operator rework and scrap will be eliminated. A typical system for underfill is configured with these additional options: Standalone: PCD4 with S Type Tips Process Calibration System Heated work area

GPD Global

Metcal-5000 Archives - Lewis and Clark

Lewis & Clark | http://www.lewis-clark.com/product-tag/metcal-5000/

: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top

Lewis & Clark

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_7711-21-CIT.pdf

. Prior rework/repair skills is helpful. This is a 5-day, advanced, instructor-level course which reviews criteria for quality and reliability of reworked or repaired electronic assemblies


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