GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
: Pre-Heating from ambient temperature to 80 degrees C. Vision alignment of the device. Locate surface to dispense (z axis). Dispense the fill pass - multiple passes may be required
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
: Pre-Heating from ambient temperature to 80 degrees C. Vision alignment of the device. Locate surface to dispense (z axis). Dispense the fill pass - multiple passes may be required
GPD Global | https://www.gpd-global.com/co_website/heatConfigurations.php
. Pre-Heat Pre-heating raises the product up to operating temperature. More aggressive heating may be applied to this zone to decrease the amount of time required to bring product up to temperature
GPD Global | https://www.gpd-global.com/heatConfigurations.php
. Pre-Heat Pre-heating raises the product up to operating temperature. More aggressive heating may be applied to this zone to decrease the amount of time required to bring product up to temperature
GPD Global | https://www.gpd-global.com/dispensing-heated-applications.php
. Pre-Heat Pre-heating raises the product up to operating temperature. More aggressive heating may be applied to this zone to decrease the amount of time required to bring product up to temperature
GPD Global | https://www.gpd-global.com/co_website/heatConfigurations-max2.php
. Pre-Heat Pre-heating raises the product up to operating temperature. More aggressive heating may be applied to this zone to decrease the amount of time required to bring product up to temperature
GPD Global | https://www.gpd-global.com/heatConfigurations-max2.php
. Pre-Heat Pre-heating raises the product up to operating temperature. More aggressive heating may be applied to this zone to decrease the amount of time required to bring product up to temperature
GPD Global | https://www.gpd-global.com/dispensing-underfill-encapsulation-dam-fill.php
. Pre-Heat Pre-heating raises the product up to operating temperature. More aggressive heating may be applied to this zone to decrease the amount of time required to bring product up to temperature
| http://etasmt.com/cc?ID=te_news_bulletin,7161&url=_print
). The aim of the process is to form acceptable solder joints by first pre-heating the components/PCB/solder paste and then melting the solder without causing damage by overheating
| https://www.smtfactory.com/Hanwha-High-Flexibility-SMT-PCB-Assembly-Line-pd47679564.html
622N Lyra 732/ 733 Lyra 732N/ 733N Quantity of preheating zones 6 6 7 7 Quantity of peak zones 2 2 3 3 Max. soldering temperature pre-heating zones 300 °C and peak zones350
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