| https://www.eptac.com/soldertip/gold-removal-issues-with-hollow-cup-connectors/
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/soldertips/soldertips-soldering-with-butane-soldering-irons/
? We are concerned about the temperature as compared to regular soldering stations. Answer: Although not a standard soldering tool for the electronic business, it is another method of applying the heat to make a solder joint. Is it hotter? I would say yes
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-soldering-with-butane-soldering-irons
. Answer: Although not a standard soldering tool for the electronic business, it is another method of applying the heat to make a solder joint. Is it hotter? I would say yes
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
manufacturer as a guide. NOTE This is necessary since manual crimping tools are available; they are custom designed and applicable only for particular connector shells. b. The supplier shall set up the tool for the cable and connector types by a detailed
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6007.html
. SMEMA 930 00344082-01 BALLAST CIRCUIT, REINFORCED F5HM 00344104S02 STRIP REMOVAL PLATE 3 x 8mm Feeder 00344108S01 Window axis 00344109S05 Hubmagnet, komplett 00344181S01 Stabilizing rail (placement head
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