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become increasingly popular throughout the research and design world. 3D printing is the process of laying down successive layers of material until a three-dimensional object forms
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Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Process and design-related causes Process and design-related causes
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:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
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. Whether the PCB position is installed accurately depends on whether there is an error in the process of the packaging component. If the staff does not check the position, the printed board is easily discarded and cannot be used in production printing
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. Whether the PCB position is installed accurately depends on whether there is an error in the process of the packaging component. If the staff does not check the position, the printed board is easily discarded and cannot be used in production printing
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