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| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
. The same condition can occur if the PCB itself warps and twist during the soldering process. I would recommend reviewing the thermal profile and the warp and twist characteristics of both the board and the components
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| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. I would suggest two items to consider. One is to review the artwork to determine the metal load on each pad. Secondly, review the thermal profile for the particular product being processed to verify the proper temperatures were met during the reflow cycle
| https://www.eptac.com/soldertip/soldertip-46-open-connections-found-on-bga-components/
. The same condition can occur if the PCB itself warps and twist during the soldering process. I would recommend reviewing the thermal profile and the warp and twist characteristics of both the board and the components
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-46-open-connections-found-on-bga-components
. The same condition can occur if the PCB itself warps and twist during the soldering process. I would recommend reviewing the thermal profile and the warp and twist characteristics of both the board and the components
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