| https://www.eptac.com/iot-and-the-aerospace-industry-too-risky/
IoT and the Aerospace Industry – Too Risky? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASCEN Technology | https://www.ascen.ltd/face_mask_production_line/689.html
Huge Profit From Mask Making Machine,Is It Too Late To Invest Mask Production Line? -PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
. Cool solder -- peak temperature is too low or time too short The peak temperature should be 20~25°C higher than the solder liquid point and remains there for 30~90 seconds. Cooling zone (below 217~220°C after reflow
Heller Industries Inc. | https://hellerindustries.com/voids/
before it solidifies. Process and design-related causes of circuit board voids: Improper solder volume due to improper land design Improper solder volume due to blocked stencil aperture Improper solder volume due to improper stencil design Paste viscosity too low Paste metal
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
. Cool solder -- peak temperature is too low or time too short The peak temperature should be 20~25°C higher than the solder liquid point and remains there for 30~90 seconds. Cooling zone (below 217~220°C after reflow
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
. Cool solder -- peak temperature is too low or time too short The peak temperature should be 20~25°C higher than the solder liquid point and remains there for 30~90 seconds. Cooling zone (below 217~220°C after reflow
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
) • Misaligned solder mask (overlapping solder pad and print area) • Flux is too weak for the oxidation level of the board and/or components
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
(overlapping solder mask) Misaligned solder mask (overlapping solder pad and print area) Flux is too weak for the oxidation level of the board and/or components Components have marginal solderability
