| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. Pb as an additive to Sn to form solder also has its own advantages. Pb lowers the surface tension of pure Sn, which equates to better wettability/solderability
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. Pb as an additive to Sn to form solder also has its own advantages. Pb lowers the surface tension of pure Sn, which equates to better wettability/solderability
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Abstract 24-2 Copper Wire Bonding on Pure Palladium Surface Finishes - Eliminating The Gold Cost from The Electronic Package Mustafa Özkök, Hugh Roberts, and Horst Clauberg Abstract 24-2 Development of a Packaging System for Clinical Evaluation of a
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