Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
? Bob Wettermann Free! 2018 Tin Whisker - All You Should Know Dr. Jennie S. Hwang $200.00 2018 Stencil Printing Process and Solder Paste Inspection – An In-Depth Look S
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
: Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling Webinar Jun 23, 2020 Webinar
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
: Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling Webinar Jun 23, 2020 Communicating With Impact and Developing Your Authentic
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
) is removed by reaction with mild liquid organic fluxes (e.g. Indium Corporation’s 5RMA) or formic acid/N2. The use of formic acid as a reducing agent for tin (Sn) based reflow soldering has been widely studied and globally applied. Gas phase formic
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