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. The Q-BAM image was made to show the relative depth of the delaminations. Each delamination intersected by the white line in the planar image corresponds to a bright feature in the Q-BAM image
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Acoustic Microscope Image and Cross-Section - Application Note 2083 DELAMINATIONS AND VOIDS Nordson SONOSCAN Bonded Wafer Delaminations and Voids - Application Note 419 C-SAM AND Q-BAM Nordson SONOSCAN
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Voids - Application Note 419 C-SAM AND Q-BAM Nordson SONOSCAN Plastic BGA - Q-BAM acoustic cross-section - Application Note 2614 Automotive Nordson SONOSCAN When a circuit is being used in an
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- Application Note 419 C-SAM AND Q-BAM Nordson SONOSCAN Plastic BGA - Q-BAM acoustic cross-section - Application Note 2614 Automotive Nordson SONOSCAN When a circuit is being used in an aerospace, military or
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. Multiple Q-BAM performed. Result Voids (bright spots) were detected within the bulk of the ceramic material. Multiple Q-BAM was performed, allowing for a non-destructive cross-section at three locations on the sample
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. For example, a cross-sectional view (Q-BAM), is the best method for viewing the orientation of various layers with respect to the top surface of a sample
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- Application Note 419 C-SAM AND Q-BAM Nordson SONOSCAN Plastic BGA - Q-BAM acoustic cross-section - Application Note 2614 Nordson Test & Inspection Leadership Nordson SONOSCAN Nordson Test
