PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post9714.html
? Posted: 03 Feb 2019 at 8:55am According to IPC-J-STD-001, the chip package fillet height should be 25% of the package height or 0.50 mm, which ever is greater
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post10025.html
? Posted: 03 Feb 2019 at 8:55am According to IPC-J-STD-001, the chip package fillet height should be 25% of the package height or 0.50 mm, which ever is greater
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/does-capacitor-height-affect-pad-geometry_topic2366.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2366&OB=ASC.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2306&OB=ASC.html
. The problem is more obvious for QFN parts. When using the "least" setting the it looks like the toe is just too short and the solder creates a bubble shaped contact instead of a nice fillet
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post12081.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
