394 qfn non-wetting results

4 Common Errors In SMT Assembly - Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/

. Non Wetting Or De Wetting Non-wetting is an SMT defect that occurs when the base metal surface on the board doesn’t accept the molten solder, creating a poor joint condition where a component’s terminals

Blackfox Training Institute, LLC

4 Common Errors In SMT Assembly - Blackfox - Premier Training and Certification

Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/4-common-errors-in-smt-assembly/

. Non Wetting Or De Wetting Non-wetting is an SMT defect that occurs when the base metal surface on the board doesn’t accept the molten solder, creating a poor joint condition where a component’s terminals

Blackfox Training Institute, LLC

•  Know the weaknesses of a solder joint •  What is takes to make a solder joint •  Defined wetting and non-wetting •  Defined the cohesive and adhesive forces 3 Wetting Angles 4 Adhesive Liquid Forces

| https://www.eptac.com/wp-content/uploads/2013/06/eptac_06_19_13.pdf

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance

ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance

ASYMTEK Products | Nordson Electronics Solutions

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print

: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters

.  Anomalies other than dewetting, non- wetting, and pin holes are not cause for rejection. 11 Evaluation Aids 12 Evaluation Aids 13 Wetting Balance Graph Negative forces Positive forces Time to reach equilibrium Time typically in seconds Y F O R C E 14 Flux Performance

| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf

.  Anomalies other than dewetting, non- wetting, and pin holes are not cause for rejection. 11 Evaluation Aids 12 Evaluation Aids 13 Wetting Balance Graph Negative forces Positive forces Time to reach equilibrium Time typically in seconds Y F O R C E 14 Flux Performance

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf

Technical Papers - X-ray Inspection

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection

Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow High powered devices require electrical circuits with good thermal conductance and minimal voiding, to maintain long

ASYMTEK Products | Nordson Electronics Solutions

SMT

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt

interfaces are harder to see optically. High resolution X-ray inspection products such as Quadra 3  and Explorer One  allow non destructive inspection of solder, post reflow

ASYMTEK Products | Nordson Electronics Solutions