GPD Global | https://www.gpd-global.com/fluid-dispense-solderpaste-dispenser.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
GPD Global | https://www.gpd-global.com/solder-paste-dispense-systems.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
: Non-coplanar leads on the component Excessive warpage of the PCB or substrate Poor wetting Insufficient amount of solder due to improper printing parameters Skips in the printed solder due to blocked
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/fluxplus-paste-flux
. EFD provides a wide array of formulations for use in a variety of applications. Features & Benefits Controlled flux spread as a result of precise dispensing Holds small parts in place before soldering Delivers more flux compared to flux-core wire solder Formulas for wetting to difficult-to-solder surfaces
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2016-03-released_topic1875.xml
” toolbarCalculator:Update PTH TO-220 to add Alpha-numeric pin assignmentsPreferences:Updated the Components tree to add PSON and PQFNFP Designer:Updated the Finish Tab to allow the user to enter Case Code and make that the Footprint NameUpdated Non-plated hole pad shape from “Donut” to “None
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/overhanging-die?con=t&page=5
- Emphasis on BGA, QFN, 3D Packages and Counterfeit Components Nordson DAGE Paragon Bondtesting Software Brochure Nordson DAGE Quadra Series Brochure Nordson DAGE 4800 Advanced Wafer Level Bondtesing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-counting-systems?con=t&page=13
… 5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum Conference & Exhibition Nordson DAGE Visit our Distributor Metronelec at this Exhibition to learn more about Nordson DAGE X-ray and Bondtester systems Common Process Defect Identification of QFN Packages Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/flexural-testing?con=t&page=16
& inspection Solutions for SMT Manufacture Nordson DAGE Ready for more Automation Nordson DAGE Implications of Using Lead-Free Solders on X-ray Inspection of Flip Chips and BGA's Nordson DAGE Common Process Defect Identification of QFN Packages Nordson DAGE Computerized Tomography Meets the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/maintenance-free-x-ray-inspection-now-available-for-pcba-production-applications
. Quadra 3 is ideal for detecting a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit devices screening
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/library-expert-2017-20-released_topic2250.html
& QFN Thermal Pad Paste Mask to 100%, Library Expert was still using a “Pattern” pad, rather than a solid pad General: Fixed an issue where pad stacks with offsets would not be generated properly in pins that were rotated
