Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/different-tolerances_topic1618.html
. I agree, but height is currently specified within Step file's name, for example CAPC2012X80. For this reason, I see no issues using current naming convention for Step files that do not involve unique packages. Tom H wrote
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/different-tolerances_topic1618_post6614.html
an abbreviation of the Mfr. Name as a prefix followed by a hyphen. Example: TI-QFN50P350X350X100-19_15T205X205 This is the Texas Instruments QFN for the RHL case code
| https://ipcapexexpo.org/media/33/download
a senior level executive of an EMS company to attend This event brings EMS leaders together to discuss key issues driving business success such as: IPC’s industry intelligence initiatives Global EMS market updates Economic impacts Emerging technology
