PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2306&OB=ASC.html
. The problem is more obvious for QFN parts. When using the "least" setting the it looks like the toe is just too short and the solder creates a bubble shaped contact instead of a nice fillet
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_does-capacitor-height-affect-pad-geometry_topic2366.xml
? : According to IPC-J-STD-001, the... Author: Tom HSubject: 2366Posted: 03 Feb 2019 at 8:55amAccording to IPC-J-STD-001, the chip package fillet height should be 25
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.xml
0.65 mm and the Toe should be 0.50 mm for the best Toe Fillet. The DPAK is a separate component family Terminal Lead Form in Library Expert with different Toe values than SOP, QFP, SOT and SOD.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10535.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2587&OB=DESC.html
0.65 mm and the Toe should be 0.50 mm for the best Toe Fillet. The DPAK is a separate component family Terminal Lead Form in Library Expert with different Toe values than SOP, QFP, SOT and SOD
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2587&OB=ASC.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
