Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/vacuum-demo-data.pdf
%) Normal Reflow Vacuum Reflow Heller Vacuum Data - Automotive QFN Automotive SMT – QFN Vacuum Parameters • Pump Rate: 300torr/sec • Dwell: 15 sec @ 10 torr Void Rate • No Vacuum: 20-40% • With Vacuum: <1% Low Void (<1%) Normal Reflow Vacuum Reflow 40
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/application/semiconductor
Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow Leistungsstarke Geräte erfordern elektrische Schaltungen mit guter
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/x-ray
. Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow High powered devices require electrical circuits with good thermal conductance and minimal voiding, to maintain
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection
Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow High powered devices require electrical circuits with good thermal conductance and minimal voiding, to maintain long
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/semiconductor
Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow High powered devices require electrical circuits with good thermal conductance and minimal voiding, to maintain
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. Solder Paste Considerations for Fine Pitch Devices. Latest Techniques for QFN and LGA Installation. Solder Bumping vs. Solder Paste. Tacky Flux vs. Solder Paste. How to acheive a Void Fee component installation
