Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. For applications where the QFN may be subjected to regular shocks (for example in a mobile phone) mechanical pull and shear testing ensures adhesion strength is acceptable and protects against future latent failures. More information
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
– No drop-in universal no lead paste – work with vendors is critical – Void formations can be an issue in no leads 5°C - 15°C15°C – 35°C“True” Process Window 230°C – 240°C230°C – 240°CMax PCB Temp 225°C – 235°C205°C - 215°CTypical Peak Temperature Range 216
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
– No drop-in universal no lead paste – work with vendors is critical – Void formations can be an issue in no leads 5°C - 15°C15°C – 35°C“True” Process Window 230°C – 240°C230°C – 240°CMax PCB Temp 225°C – 235°C205°C - 215°CTypical Peak Temperature Range 216
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/explorer-one
one enables you to quickly understand the quality of your product before it leaves the factory. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, cable and connector quality and counterfeit component screening
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/quadra-5-x-ray-inspection-system
. Inbuilt automated tools for BGA quality analysis, bump diameter and roundness, wire sweep, solder and QFN voiding make quick work of finding defects, helping you achieve IPC-A-610 and IPC-7095 compliance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/dryers?con=t&page=11
Corporation 01_048940_Nordson_Advances Nordson Corporation Real Time X-Ray Analysis of Void Formation and dynamics in QFN devices during reflow Nordson Corporation 68SMTAI03MSDHighRelSRM Nordson
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2593&OB=DESC.html
. The smallest visible markings range from 0.30 mm – 0.40 mm and are typically used for micro-miniature packages or very dense part placement PCB layouts
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