| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
temperature and warm-up speed. Capillary: When melt solder wets to the component pin but still stays far away from the contact area, Pseudo soldering will be caused. The reason is that when solder is melting, pin temperature is higher than pad temperature
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
temperature and warm-up speed. Capillary: When melt solder wets to the component pin but still stays far away from the contact area, Pseudo soldering will be caused. The reason is that when solder is melting, pin temperature is higher than pad temperature
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
• Remove Needle/Nozzle Support section - relocated to separate document PN 22200609. • Add additional images of calibration station. 03/03/2015 2.8 New • Add specifications: Volts AC note, 2-pole 3 wire ground note, power cable wire gauge specs
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
. Contact manufacturer for more information. When the front shield is open, syringe pressure is zero (0). WARNING Items that become solid waste include
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-User-Guide-22100079K.pdf
. Refer to Dispenser User Guide and Dispense System Service Guide. Larger unintended release can be caused when remote source of materials is not properly utilized. Contact manufacturer for more information. When the front shield is open, syringe pressure
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-User-Guide-22100079K.pdf
. Refer to Dispenser User Guide and Dispense System Service Guide. Larger unintended release can be caused when remote source of materials is not properly utilized. Contact manufacturer for more information. When the front shield is open, syringe pressure
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
# of PCB layers, larger internal connections, thicker Cu ground layers and poor Cu balance that in some cases cannot be fix by designers difficult current soldering processes narrowing process window
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