| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-component-tombstone-on-flex-circuit
. From a process perspective, the issue is vibration with flex type of materials. The component could be more in contact with one pad than the other and the wetting of the unreflowed solder paste could pull up the component and cause it to tombstone
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
Are Voids in Solder Joints Really an Issue? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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” smooth bore HPM, processing High Molecular Weight HDPE (HMWHDPE). They wanted a solution that would remedy their melt quality issue and decrease their scrap rate
KingFei SMT Tech | http://www.smtspare-parts.com/quality.html
China Dongguan Kingfei Technology Co.,Limited quality control Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
KingFei SMT Tech | https://www.smtspare-parts.com/quality.html
China Dongguan Kingfei Technology Co.,Limited quality control Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-automatic-solder-nozzle-tinning-system-ensures-consistent-quality
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| https://www.eptac.com/blog/understanding-bare-board-inspection-an-essential-quality-control-measure
Understanding Bare Board Inspection: An Essential Quality Control Measure Looking for solder training standards, manuals, kits, and more
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