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PBGA CROSS SECTION VOIDS ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● Gen6 ● D9600 ● D9600Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
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% of the cross sectional area of a strand. This is difficult to explain or visualize on... Question: Section 6.3.2 on strand damage is confusing in the new Rev E document
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% of cross sectional area, was added to describe the depth of the damage related to nicks or scrapes. Cross section is a 2-dimensional view of a slice through an object
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Acoustic Microscope Image and Cross-Section - Application Note 2083 DELAMINATIONS AND VOIDS Nordson SONOSCAN Bonded Wafer Delaminations and Voids - Application Note 419 C-SAM AND Q-BAM Nordson SONOSCAN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/advanced-features/quantitative-b-scan-analysis-mode
Quantitative B-Scan Analysis Mode (Q-BAM)™ Quantitative B-Scan Analysis Mode (Q-BAM)™ is a calibrated, non-destructive cross-section image in the X-Z plane of a sample, which is completely in focus through the entire Z depth and contains amplitude/polarity data
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Defects - Application Note 2158 VOIDS AND DELAMINATIONS Nordson SONOSCAN Ceramic Chip Capacitor Acoustic Microscope Image and Cross-Section - Application Note 2083 DELAMINATIONS AND VOIDS Nordson SONOSCAN
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About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes C-SAM AND Q-BAM C-SAM AND Q-BAM PBGA Virtual Cross-Section
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VOIDS AND DELAMINATIONS Nordson SONOSCAN Ceramic Chip Capacitor Acoustic Microscope Image and Cross-Section - Application Note 2083 DELAMINATIONS AND VOIDS Nordson SONOSCAN Bonded Wafer Delaminations and
