ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2083-voids-and-delaminations
Capacitor Acoustic Microscope Image and Cross-Section - Application Note 2083 Sample & Method A set of five multilayer ceramic chip capacitors were imaged on the C-SAM instrument using a 50 MHz
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
°C N2 Good Wetting with Grainy Surface Finish PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 11 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 3 Thin Intermetallic Layer No Voids BGA Cross Section Material
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
°C N2 Good Wetting with Grainy Surface Finish PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 11 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 3 Thin Intermetallic Layer No Voids BGA Cross Section Material
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=11
) Direct Bond Copper Defects - Application Note 1066 PBGA CROSS SECTION VOIDS Nordson SONOSCAN PBGA 3D Cross-Sectioned Voids in Molding Compound - Application Note 206 First
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=11
) Direct Bond Copper Defects - Application Note 1066 PBGA CROSS SECTION VOIDS Nordson SONOSCAN PBGA 3D Cross-Sectioned Voids in Molding Compound - Application Note 206 UNDERFILL VOIDS Nordson SONOSCAN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/medical-life-science-and-pharmaceutical?con=t&page=11
) Direct Bond Copper Defects - Application Note 1066 PBGA CROSS SECTION VOIDS Nordson SONOSCAN PBGA 3D Cross-Sectioned Voids in Molding Compound - Application Note 206 UNDERFILL VOIDS Nordson SONOSCAN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=11
) Direct Bond Copper Defects - Application Note 1066 PBGA CROSS SECTION VOIDS Nordson SONOSCAN PBGA 3D Cross-Sectioned Voids in Molding Compound - Application Note 206 UNDERFILL VOIDS Nordson SONOSCAN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=11
) Direct Bond Copper Defects - Application Note 1066 PBGA CROSS SECTION VOIDS Nordson SONOSCAN PBGA 3D Cross-Sectioned Voids in Molding Compound - Application Note 206 First
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/applicators/truecoat-hp-slot-applicators
TrueCoat® HP Slot Applicators TrueCoat® HP (High-Performance) Slot Applicators are developed to improve the industry standard for achieving high accuracy of adhesive distribution in cross-web and machine direction. TrueCoat®
| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint? Question
