| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems?con=t&page=5
PBGA CROSS SECTION VOIDS Nordson SONOSCAN PBGA 3D Cross-Sectioned Voids in Molding Compound - Application Note 206 PBGA 3D SECTIONED VOIDS Nordson SONOSCAN PBGA 3D Sectioned Voids in Molding Compound
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
) metallographic cross-sectioning thru package/solder joint interface showed a high incidence of voiding not observed in orthogonal cross-section
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
) metallographic cross-sectioning thru package/solder joint interface showed a high incidence of voiding not observed in orthogonal cross-section
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/products/mixers/2-part-disposable-material-mixers
” cross section, the alternating elements are joined so the leading and trailing edges are mutually perpendicular. This geometry ensures long life and flushes clean with less solvent
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/nozzles/universal-summit-nozzles
; open patterns for absorbency; or highly dense fine-fiber patterns for heat-sensitive substrates. Achieve greater uniformity in the cross-web direction
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/medical-life-science-and-pharmaceutical?con=t&page=4
: Medical, Life Science and Pharmaceutical C-SAM AND Q-BAM Nordson SONOSCAN PBGA Virtual Cross-Section - Application Note 2602 VOIDS AND DELAMINATIONS Nordson SONOSCAN Ceramic Chip Capacitor Voids and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2018-04-02
; an elongated teardrop, diminishing volume manifold cross-section improves layer uniformity in coextrusion; and a non-linear interface between the preland and manifold greatly reduces or eliminates “M” or “W” flow patterns
