Partner Websites: re balling (Page 1 of 1)

Beamworks Spark 400

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_selective_beamworks_spark400.html

Components Lead Free High Temperature Soldering Re-balling All types of BGA Flip-Chip & CSP Assembly Unique & special Applications Main Benefits

1st Place Machinery Inc.

BGA Rework Training and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training

. BGA removal and replacement process. Inspection and interpreting x-ray results. BGA Re-Balling BGA pad Repair Flux Considerations for BGA's, LGA's and QFN's

Precision PCB Services, Inc

SRT Training, Calibration and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/srt-training-calibration-and-certification

. Equipment review BGA Re-Balling Optical Calibration Heater Testing and Calibration Certification   Upon completing the course each student receives a certification from Precision PCB Services, Inc

Precision PCB Services, Inc

Call for Participation: Technical Paper | IPC APEX EXPO 2021

| https://ipcapexexpo.org/education/call-for-technical-paper-form

2.5-D/3-D Component Packaging BGA Packaging Connectors Design for Excellence (DFX) Design for Manufacturability (DFM) Design for Test (DFT) Die attach Embedded Passive and Active Devices Flexible Circuits Flip Chip/0201 Metric Package on Package Printed Electronics RFID Circuitry Re-balling Components Semiconductor Wire Bonding Other

How to Prevent a Solder Ball Defect | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/

– Problems in the solder paste itself can contribute to the formation of solder balling. Thus, it is not advised to re-use solder paste or allow the usage of solder paste past its expiration date

Imagineering, Inc.

Call for Participation | IPC APEX EXPO 2021

| https://ipcapexexpo.org/education/call-for-participation

2.5-D/3-D Component Packaging Package on Package Flip Chip/0201 Metric Re-balling Components Connectors Die attach Semiconductor Wire Bonding Ultra-thin die assembly BGA Packaging Quality, Reliability

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

Processes Lean Six Sigma Green Belt Lean Six Sigma Online Re-certification In-House Certification Certified Engineers Webinars Live Webinars Archived Webinars Resources Knowledge Base Find Technical

Surface Mount Technology Association (SMTA)

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re balling searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Software for SMT

High Precision Fluid Dispensers
Void Free Reflow Soldering

High Throughput Reflow Oven
PCB separator

"回流焊炉"