Partner Websites: recognition error (Page 1 of 6)

SMT Process Status and Future Development Trends-SMT Technical-Reflow oven,SMT Reflow Soldering Oven

| http://etasmt.com:9060/te_news_industry/2019-05-28/6361.chtml

. Whether the PCB position is installed accurately depends on whether there is an error in the process of the packaging component. If the staff does not check the position, the printed board is easily discarded and cannot be used in production printing

RS-1R | JUKI Smt High Speed Pick And Place Machine from China manufacturer - I.C.T SMT Machine

| https://www.smtfactory.com/RS-1R-JUKI-Smt-High-Speed-Pick-And-Place-Machine-pd49094264.html

with advanced vision recognition technology?Yes, it is equipped with cutting-edge vision systems that ensure precise component placement and error detection. 8. How does the JUKI RS-1R contribute to improved product quality?The machine's accuracy and

4600-LF Automated Lead Frame Test Solution

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4600-lf-automated-lead-frame-test-solution

. The indexer of the 4600-LF accurately transfers the product safely to the bond tester, guaranteeing no human error. Simply place a magazine onto the handler, quick clamp it into place, and your product remains protected.         Maximum UPH   The 4600

ASYMTEK Products | Nordson Electronics Solutions

I.C.T High Speed on-Line 3D SPI Solder Paste Inspection Equipment I.C.T-S400 from China manufacturer

| https://www.smtfactory.com/I-C-T-High-Speed-on-Line-3D-SPI-Solder-Paste-Inspection-Equipment-I-C-T-S400-pd49143724.html

. 2. It can be imported into Gerber file programming, or can be used to edit and debug money from image editing mode. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

I.C.T 3D Spi smt Solder Paste inspection machine I.C.T-S400 - Dongguan Intercontinental Technology C

| https://www.smtfactory.com/I-C-T-3D-Spi-smt-Solder-Paste-inspection-machine-I-C-T-S400-pd49143724.html

. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

I.C.T-S400 | 3D SPI SMT Solder Paste Inspection Machine from China manufacturer - I.C.T SMT Machine

| https://www.smtfactory.com/I-C-T-S400-3D-SPI-SMT-Solder-Paste-Inspection-Machine-pd49143724.html

. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

LED Manufacturing Line 0.67um Accurancy SMT SPI Machine

| https://www.feedersupplier.com/sale-13240673-led-manufacturing-line-0-67um-accurancy-smt-spi-machine.html

. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

LED Manufacturing Line 0.67um Accurancy SMT SPI Machine

| http://www.feedersupplier.com/sale-13240673-led-manufacturing-line-0-67um-accurancy-smt-spi-machine.html

. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

550KG IP2X 3 Dimensional Measurement SMT SPI Machine

| https://www.feedersupplier.com/sale-13240697-550kg-ip2x-3-dimensional-measurement-smt-spi-machine.html

.It can be imported into Gerber file programming, or can be used to edit and debug money from image editing mode. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

550KG IP2X 3 Dimensional Measurement SMT SPI Machine

| http://www.feedersupplier.com/sale-13240697-550kg-ip2x-3-dimensional-measurement-smt-spi-machine.html

.It can be imported into Gerber file programming, or can be used to edit and debug money from image editing mode. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4

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