| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies
. How many more rework cycles can we do before compromising the reliablity of the assemblies?” In the past we used to recommend 5 thermal cycles and a removal and replacement was consider one cycle
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_minimum-gang-solder-mask-web_topic2381.xml
:29amIn my 36 year PCB design career, I have never seen a Gang Mask on a BGA. And I would not recommend that you do that. There must be Solder Mask between every BGA pad to prevent solder bridging under the package.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_modern-pcb-design-class-for-experienced-designers_topic2087.xml
? : I would also recommend Susy... Author: SteveASmithSubject: 2087Posted: 10 Feb 2017 at 9:30amI would also recommend Susy Webb's "Designing with your 'Thumbs' workshop class
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Transport-Wheel-Tensioning-817-1-4_DOC.pdf
. Transport wheel tension should be rechecked monthly or if inconsistent forming occurs. We recommend using a dial indicator during the following procedure
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Transport-Wheel-Tensioning-817-1-4_DOC.pdf
. Transport wheel tension should be rechecked monthly or if inconsistent forming occurs. We recommend using a dial indicator during the following procedure
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/nominal-epad-vs-max-epad_topic2530.html
. This is why the component mfr.'s recommend the nominal pad size. The manufacturer builds extensive test boards and reference designs
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/nominal-epad-vs-max-epad_topic2530_post10399.html
. This is why the component mfr.'s recommend the nominal pad size. The manufacturer builds extensive test boards and reference designs
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/nominal-epad-vs-max-epad_topic2530_post10400.html
. The last part on the PCB is the land pattern they recommend. Not every mfr. does this, but how do you know which one did. Since IPC never created any test boards to validate the 7351 guideline for solder joint goals there is no conclusive evidence that the solder joint goals in the guideline are optimized for the best assembly attachment
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/nominal-epad-vs-max-epad_topic2530_post10400.html
. The last part on the PCB is the land pattern they recommend. Not every mfr. does this, but how do you know which one did. Since IPC never created any test boards to validate the 7351 guideline for solder joint goals there is no conclusive evidence that the solder joint goals in the guideline are optimized for the best assembly attachment
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2530&OB=DESC.html
. The last part on the PCB is the land pattern they recommend. Not every mfr. does this, but how do you know which one did. Since IPC never created any test boards to validate the 7351 guideline for solder joint goals there is no conclusive evidence that the solder joint goals in the guideline are optimized for the best assembly attachment
