ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/smtai-2015
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GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Capillary Underfill Capillary Underfill Dispensing Typically Used for Silicon Die or BGA Applications in High Shock Environments or When Consistent Reliability is Required The Capillary Underfill
GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Capillary Underfill Capillary Underfill Dispensing Typically Used for Silicon Die or BGA Applications in High Shock Environments or When Consistent Reliability is Required The Capillary Underfill
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Capillary Underfill Capillary Underfill Dispensing Typically Used for Silicon Die or BGA Applications in High Shock Environments or When Consistent Reliability is Required The Capillary Underfill
| https://www.smtfactory.com/pcb-x-ray-inspection-machine
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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Jörg Trodler, Adam Murling Abstract 2018 31-2 Fill The Void III Tony Lentz Abstract 31-2 Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate - Influence of Eigenmodes
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/10/Reflow-Soldering-2020.pdf
technology inserts into reflow oven lines to meet increasing demand for high-volume, void-free automated inline soldering. Heller reports this module reduces voids in a solder joint by 99%. It enables thermal profile porting directly from non-vacuum reflow
Heller Industries Inc. | http://hellerindustries.com/wp-content/uploads/2022/05/Reflow-Soldering-2020.pdf
technology inserts into reflow oven lines to meet increasing demand for high-volume, void-free automated inline soldering. Heller reports this module reduces voids in a solder joint by 99%. It enables thermal profile porting directly from non-vacuum reflow
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/05/Reflow-Soldering-2020.pdf
technology inserts into reflow oven lines to meet increasing demand for high-volume, void-free automated inline soldering. Heller reports this module reduces voids in a solder joint by 99%. It enables thermal profile porting directly from non-vacuum reflow
