Heller Industries Inc. | https://hellerindustries.com/reflow-soldering-oven/
/ medium volume throughput… at speeds up to 24 inches (60 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen
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: 591200-10---5 T/C Mount Profile Board 591200-12---5 T/C Mount Profile Board 591208-01---OUTER BOX 4.75" IMP MK3.6 591208-02---OUTER BOX 4.75" IMP W/EXH MK3.6 591224-01---.11 HP Motor ASSY
Heller Industries Inc. | https://hellerindustries.com/reflow-soldering-problems-overview/
Reflow Soldering - Heller Home » Reflow Soldering Reflow Soldering Solutions for Reflow Soldering Problems The reflow soldering profile The reflow soldering profile must be matched to the specific requirements of the solder paste as well as the thermal thresholds of the PCB assembly
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the equipment side. A. Indium Corporation: Experimental In this experimental design, the key input (independent) variables are the solder alloy, reflow profile and number of reflows while the measured (dependent) variable is overall void percent. The
Heller Industries Inc. | https://hellerindustries.com/smt-reflow-ovens/smt-reflow-oven/
0.1ºC, thereby maintaining profile integrity for heavy board loads. Wide process window for “universal profiling” – allows many different boards to be run on a single temperature profile Advanced 5 thermocouple PCB profiling
Heller Industries Inc. | https://hellerindustries.com/kic/
. When starting new assembly production users simply input product length, width and weight along with the required process window. Auto-Focus will within seconds display the recommended oven recipe, prior to running a profile
Heller Industries Inc. | https://hellerindustries.com/cpk/
. Continuous 24-hr product quality monitoring Board dynamic profile generation without attaching thermocouples Automatic SPC Analysis & Alert Reporting Archiving of the dynamic profile of each pcb processed for later playback Remote alarm capability for off-site troubleshooting This helps to provide your customers with proof of your product quality. Tier 3
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
? The chemistry involved with formic acid reflow is a two-step process: During the soak phase of a thermal profile (between ~ 150C and 200C), formic acid vapor is introduced into the process chamber where it reacts with the metal oxides on the solder and creates formate salts
Heller Industries Inc. | https://hellerindustries.com/voidless-vacuum-reflow-ovens/
”) in heated length with minimal floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
What Are Reflow Soldering Defects - Heller Home » What Are Reflow Soldering Defects Reflow Soldering Defects & Causes DEFECT / CAUSE RELATIONSHIP Coplanarity Contamination Metallurgy Solder Quality Solder Volume Reflow Profile Placement Accuracy Land Design Reflow Cycle Too Long Excessive Reflow Temp
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