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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/semiconductor
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: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector? Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/application/semiconductor
. Overcoming Passivation Layer Interference in Ball Shear Testing App Note Bondtesting of Memory Devices Low Profile Zone Shear App Note Cu Pillar App Note First Bond Ball and Stud Bump Pull for Copper
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Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include: A review of the parameters for establishing a safe thermal profile
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