PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic695&OB=ASC.html
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
. Key Advances in Void Reduction with Vacuum Technology One of the challenges facing the industry is the requirement to significantly reduce voids from the process
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
. Key Advances in Void Reduction with Vacuum Technology One of the challenges facing the industry is the requirement to significantly reduce voids from the process
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. with all phase change from solid-liquid-solid to be performed under vacuum, which would induce any entrapped void in the molten solder to expand, and expulsion from the solder bump by buoyancy forces
Heller Industries Inc. | https://hellerindustries.com/cpk/
customer audit trace-ability Immediate notification of any out of spec conditions Engineers can automatically be notified by pager or e-mail Dramatically reduce scrap and rework KNOW that the assemblies have
