Partner Websites: reducing and solderballs and post and reflow (Page 1 of 3)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

°C Temperature Range [7] Kim’s investigation utilized two different reflow profiles – typical (aka LSLP) and non-typical (aka Extreme) – to generate voids in the BGA solder joints

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

°C Temperature Range [7] Kim’s investigation utilized two different reflow profiles – typical (aka LSLP) and non-typical (aka Extreme) – to generate voids in the BGA solder joints

Heller Industries Inc.

Flux-Free Formic Reflow Soldering-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23566&url=_print

gas phase Formic Acid (HCOOH) to replace standard fluxing agents Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps No post-reflow flux clean facilitates inline application of epoxy and inline epoxy

Flux-Free Formic Reflow Soldering-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23566.chtml

gas phase Formic Acid (HCOOH) to replace standard fluxing agents Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps No post-reflow flux clean facilitates inline application of epoxy and inline epoxy

Flux-Free Formic Reflow Soldering-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23566.chtml

gas phase Formic Acid (HCOOH) to replace standard fluxing agents Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps No post-reflow flux clean facilitates inline application of epoxy and inline epoxy

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf

. 5 Side view schematic of solder spread on Cu; D: solder bump spread diameter post reflow; H: solder ball height post reflow. IV. RESULTS AND DISCUSSION A. Oxide removal agent wetting analysis As shown in Fig. 5, solder ball spread diameter (D) and

Heller Industries Inc.

Frost & Sullivan Lauds Heller Industries’ Exceptional Growth Borne of its Advanced SMT Reflow Solder

Heller Industries Inc. | https://hellerindustries.com/reflow-news/frost-sullivan-lauds-heller-industries-exceptional-growth-borne-of-its-advanced-smt-reflow-soldering-equipment-for-industry-4-0/

eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps. Such partnerships have gone a long way in helping the company win new customers and retain existing ones. Heller Industries’ R

Heller Industries Inc.

Frost & Sullivan Lauds Heller Industries’ Exceptional Growth Borne of its Advanced SMT Reflow Solder

Heller Industries Inc. | https://hellerindustries.com/news/frost-sullivan-lauds-heller-industries-exceptional-growth-borne-of-its-advanced-smt-reflow-soldering-equipment-for-industry-4-0/

eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps. Such partnerships have gone a long way in helping the company win new customers and retain existing ones. Heller Industries’ R

Heller Industries Inc.

2015 Micron KEG Supplier Summit

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf

• Fluxless reflow utilizes gas phase Formic Acid (HCOOH) to replace standard fluxing agents • Eliminates the need for pre-reflow fluxing and post- reflow flux cleanup steps

Heller Industries Inc.

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