ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/automated-optical-inspection-systems/m1-series-aoi
-speed PCB inspection with exceptional defect coverage. With three megapixel resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/automated-optical-inspection-systems/fx-940-aoi
optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/automated-optical-inspection-systems/fx-940-ultra-3d-aoi
YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 2D
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X-ray 3500 Equipment_Shenzhen Honreal Technology CO.,Ltd. HOME ABOUT Company Profile Work shop Honors Package Our Client PRODUCTS Pick and Place Machine SMT nozzle and feeder SMT Reflow Oven Line Dip wave soldering line PCB handling equipment SMT Cutting
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1148-heat-damage
. The purpose of this early experiment was to learn what effects the higher temperatures might have on conventional components. Reflow temperatures where leaded solder is used typically peak at 225o C
Heller Industries Inc. | https://hellerindustries.com/tombstoning/
(including crocodiling, surfboarding, Manhattan effect, drawbridging, Stonehenge effect, billboarding, etc.). This is a soldering defect in which a chip has been pulled into a vertical or near-vertical position with only one side soldered to the PCB
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection
Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow High powered devices require electrical circuits with good thermal conductance and minimal voiding, to maintain long
46969 | https://hellerindustries.com/wp-content/uploads/2018/07/nitrogencontrol.pdf
Heller Industries Inc.
