ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/aoi-and-x-ray-inspection-systems-combined-provide-valuable-yield-enhancement-solution
. Programmable lighting: In any machine vision application, lighting is critical to achieving the desired results. Trying to find one light source that will enable detection of all defect conditions is nearly impossible, given the ever-changing environment of electronics manufacturing
| https://www.smtfactory.com/I-C-T-4034-PCB-Printer-Solder-Paste-Support-Frameless-Stencil-Printer-pd43048364.html
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Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
Opensor Insufficient Solder Home » Opensor Insufficient Solder Re-printed in partnership with ITM Insufficient Solder Defect
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/plastic-and-polymer?con=t&page=2
&D, failure analysis and production. Products Content Your results for: Plastic & Polymer 4000 Optima Bondtester Brochure Nordson DAGE Lead-free_Inspection_Methods Nordson DAGE Prospector Brochure_2019 Nordson DAGE Correlating the Presence of Popcorned BGA Devices Post Reflow with
| https://www.eptac.com/faqs/soldertips?hsLang=en
: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition
| https://www.eptac.com/faqs/soldertips
: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/packaging?con=t&page=4
Materials Testing for Microelectronics Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements
| https://www.eptac.com/soldertips/smt-component-shifting/
: We have a problem with chip components shifting during the reflow process, which is being detected during automatic optical inspection
| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. What this means is that after identifying the defect, you have the responsibility to disposition the components to be used as-is, reworked, or scrapped
| https://www.eptac.com/faqs/ask-helena-leo/page/6
. I’m having difficulties soldering the braided shield to... Read More Solder Defect/Non-Conformity Listing for IPC-A-610 QUESTION Question
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