| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. What this means is that after identifying the defect, you have the responsibility to disposition the components to be used as-is, reworked, or scrapped
| https://www.eptac.com/faqs/ask-helena-leo/page/6
. I’m having difficulties soldering the braided shield to... Read More Solder Defect/Non-Conformity Listing for IPC-A-610 QUESTION Question
| https://www.smtfactory.com/Industry-News-ic252572.html
& Events Global Partners SMT Equipment SMT Production Line Full-auto SMT Line Semi-auto SMT Line Reflow Oven Pyxis Series Reflow Oven Lyra Series Reflow Oven L Series Reflow Oven S Series Reflow Oven
| https://www.eptac.com/soldertip/smt-component-shifting/
: We have a problem with chip components shifting during the reflow process, which is being detected during automatic optical inspection
| https://www.eptac.com/faqs/soldertips/soldertip/smt-component-shifting
: We have a problem with chip components shifting during the reflow process, which is being detected during automatic optical inspection
| https://www.eptac.com/solder-tips/
: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=16
… Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements from X-ray Inspection Nordson DAGE Micromechanical Testing of Thin Die Nordson DAGE Paragon
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
James Barnhardt Free! 2017 X-Ray Inspection of PCBs Kamran Iqbal and Bob Wettermann $200.00 2017 Webtorial: Reflow - Understanding the Complete Process & Defect Prevention Bob Willis $200.00 2017
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. A possible culprit of solder balling is moisture because when moisture saturates during reflow, it leaves solder spheres slightly outside of the solder joint
| https://www.smtfactory.com/SMT-Solution-for-Underwater-Drone-id41287377.html
Home Company Company Profile I.C.T Team Global Partners SMT Line-Up SMT Production Line Full-auto SMT Line Semi-auto SMT Line Reflow Oven Pyxis Series Reflow Oven Lyra Series Reflow Oven S Series Reflow Oven L Series Reflow Oven LV