| https://www.eptac.com/faqs/ask-helena-leo/ask/post-lead-trimming-reflow-requirements
: This following information is from Rev D of IPC-A-610. The requirement was to inspect all joints after cutting and make a determination as to whether or not the connection was damaged, then if damage was found, the solder joint was to be reflowed
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/flexural-test
. Lead free solders transmit larger strains to the bond pad which can produce cracks in the laminate. Lead free solders are reflowed at higher temperatures and this leads to greater thermal strain
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
than that of SAC305 joints. Here the joint contact area in fillet (side) is not considered. Figure 9. Fracture Area of SAC305 Joint Reflowed at 230C for 30 sec. Figure 10. Fracture Area of SnPb Joint Reflowed at 195C for 30 sec. To understand why the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
than that of SAC305 joints. Here the joint contact area in fillet (side) is not considered. Figure 9. Fracture Area of SAC305 Joint Reflowed at 230C for 30 sec. Figure 10. Fracture Area of SnPb Joint Reflowed at 195C for 30 sec. To understand why the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smd-shear
. Shear Testing Requirements SMDs are soldered on a large scale. Components are pre-pasted & reflowed or wave-soldered with a stencil
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
becoming totally molten and coalesce forming a homogeneous molten solder volume. If the solder paste appears to not have reflowed and is as identified in IPC-A-610 section 5, the issue is that the proper intermetallic has not formed at both the component and pad/land surface
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
| https://www.eptac.com/ask/soldering-minimum-space-requirements/
. If the wire is not in contact with the back wall of the cup then it is a process indicator and does not have to be fixed, by that I mean the solder joint does not have to be reflowed to reposition the wire
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
becoming totally molten and coalesce forming a homogeneous molten solder volume. If the solder paste appears to not have reflowed and is as identified in IPC-A-610 section 5, the issue is that the proper intermetallic has not formed at both the component and pad/land surface
