| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt/
. In the previous discussion we explained that the majority of these solder joints fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt
. In the previous discussion we explained that the majority of these solder joints fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5459
. Processes which affect the distribution of Bi atoms in Sn based solder joints need to be better understood. Current stressing has been shown to be very effective in promoting Bi diffusion in Sn
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/new-2016-solder-joint-goals_topic1921&OB=DESC_page2.html
: IPC-7351B Concave and Rectangular End Cap (Chip) lead-forms each only have 2 options for Toe, Heel and Side solder joints, regardless of the Chip Array pin pitch range from 0.80 mm to
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/new-2016-solder-joint-goals_topic1921.html
: IPC-7351B Concave and Rectangular End Cap (Chip) lead-forms each only have 2 options for Toe, Heel and Side solder joints, regardless of the Chip Array pin pitch range from 0.80 mm to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/new-2016-solder-joint-goals_topic1921_post8044.html
: IPC-7351B Concave and Rectangular End Cap (Chip) lead-forms each only have 2 options for Toe, Heel and Side solder joints, regardless of the Chip Array pin pitch range from 0.80 mm to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1921&OB=ASC.html
: IPC-7351B Concave and Rectangular End Cap (Chip) lead-forms each only have 2 options for Toe, Heel and Side solder joints, regardless of the Chip Array pin pitch range from 0.80 mm to
| https://www.eptac.com/webinars/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/
. It seems to continue to appear. Someone, somewhere has found voids in their solder joints on BGAs, or other surface mounted components
| https://www.eptac.com/webinars/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components
, we are still discussing this issue. It seems to continue to appear. Someone, somewhere has found voids in their solder joints on BGAs, or other surface mounted components
| https://www.eptac.com/webinar/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt/
. In the previous discussion we explained that the majority of these solder joints fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
