| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
. Especially in aerospace, aviation, automotive electronics, medical electronics and other industries that require very high stability and reliability of products, the voids rate of soldering points
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
slope (data quality) with vacuum processing. Although BGA solder joint voiding very often does not present an attachment reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. risk [14-16], the large
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
slope (data quality) with vacuum processing. Although BGA solder joint voiding very often does not present an attachment reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. risk [14-16], the large
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Alan Donaldson and Raiyomand Aspandiar, Intel Corporation "Hot Air Lead-free Rework of BGA Packages & Sockets" 2003: Dave Nelson and Hector Pallavicini, Raytheon Systems Company "Manufacturing and Reliability of Pb-free and Mixed System Assemblies (SnPb/Pb-Free
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection
. Advances in X-ray Tube Technology Comparing Digital and Analogue X-ray Inspection of BGA, Flip Chip and CSP X-ray Dose Considerations In this Application Note, Dr Nick Dajda summarizes X-ray
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Senior Process Technology Development Engineer, Intel ATTD 2008 Lei Nie, Ph.D. , CALCE @ University of Maryland (College Park, MD) Paper: "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process" Where is she now
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers
. Ribbon Testing App Note X-ray / Bondtester Reliability Study of BGA Devices - Impact of Interfacial Voiding Dage - Atotech Case Study Dage - Unovis Case Study High-Speed Solder Ball Shear and Pull Tests vs
