ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-force-pull?con=t&page=18
. Please consult us for further details. Products Content Your results for: High Force Pull Nordson Honored with SMTA Corporate Partnership Award Nordson ASYMTEK Recognition for continuous support of the electronics manufacturing association Quality and Reliability
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
(solder mask defined) and NSMD (non-solder-mask-defined), NSMD will be good than SMD for BGA pad to increase solder joint reliability
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/smd-solder-mask-defined-and-nsmd-pads_topic1768_post7236.html
(non-solder-mask-defined), NSMD will be good than SMD for BGA pad to increase solder joint reliability. What about other components
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/hdi/
. HDIs create a gateway to miniaturization of PCB design with ‘via in pad’ technology. Improve reliability by stepping up technology rather than compromising existing design rules
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t&page=14
Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE X-Ray / Bondtester Reliability Study of BGA Devices
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
www.ap.pennnet.com, Advanced Packaging Industry News January 2008 METHOD FOR AUTOMATED NONDESTRUCTIVE ANALYSIS OF FLIP CHIP UNDERFILL As distributed at the International Conference on Soldering and Reliability May 2008
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?con=t&page=14
. Products Content Your results for: Electronics - Semiconductor Investigating Voids - Circuits Assembly article Nordson DAGE X-Ray / Bondtester Reliability Study of BGA Devices
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/torsion-testing?con=t&page=15
Reliability Investigation of Printed Circuit Board Micro-vias by X-ray Inspection Nordson DAGE Assure Series Brochure _web Nordson DAGE Nordson Test and Inspection Systems at SMT Nuremburg Nordson DAGE Live
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=17
> Common Process Defect Identification of QFN Packages Nordson DAGE X-Ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding Nordson DAGE X-ray Dose DataSheet (Japanese
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/keynote.cfm
(Printed Circuit Board), Packaging, SJR(Solder Joint Reliability) and component quality/reliability since joined IBM/Lenovo in 1987. During his 31+ years career, he has developed various technical solutions for industry level critical problems such as industry wide BGA
