Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
*Michael Konrad, Aqueous Technologies Milo Reexamination of Thermal Cycling Reliability of BGA Components with SnAgCu and SnPb Solder Joints on Different Board Designs *John Evans, Ph.D
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20061608649
*Michael Konrad, Aqueous Technologies Milo Reexamination of Thermal Cycling Reliability of BGA Components with SnAgCu and SnPb Solder Joints on Different Board Designs *John Evans, Ph.D
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/flexural-testing?con=t&page=15
. Our experience with solder has led us to develop methods for applying loads to small samples as the solder joint is the weakest… Dage - Desich SMART Center Case Study Nordson DAGE Quality and Reliability Investigation of Printed Circuit Board Micro-vias by X-ray Inspection Nordson DAGE Assure Series Brochure _web Nordson DAGE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/compression-testing?con=t&page=15
… Precise inventory knowledge ensures saftey Nordson DAGE 7th May 2020 Dage - Desich SMART Center Case Study Nordson DAGE Quality and Reliability Investigation of Printed Circuit Board Micro-vias by X
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/fatigue?con=t&page=16
Fatigue Testing | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0299-pbga-die-face-delaminations
. Result Red areas along the die face are delaminations of the molding compound from the die face. Die face delaminations are a threat to reliability because they can expand during use until they shear off bond wires
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/peel-testing?con=t&page=15
Peel Testing | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/medical-life-science-and-pharmaceutical?con=t&page=5
% nondestructive test evaluation to be performed in a repeatable manner for both the development of new devices and in the production line. Medical devices and medical electronic systems are key areas where reliability is paramount
| https://ipcapexexpo.org/education/call-for-technical-paper-form
) - Select - Assembly Processes Circuit Design and Component Technologies Conscientious Engineering Enabling Future Technologies Electronics Materials Factory of the Future Implementation Meeting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-counting-systems?con=t&page=14
Continues its 'Performance Beyond Expections' with a 2013 Global Technology Award Nordson DAGE Second Award Presented to Nordson DAGE at Productronica 2013 X-Ray / Bondtester Reliability Study of BGA Devices
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