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. Underfill is applied at the following stages of the manufacturing process to improve reliability. Wafer and Panel-Level Underfill Underfill is applied within flip-chip, 2D
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.” Here is another reference to these types of voids: http://ecadigitallibrary.com/pdf/56thECTC/s06p7lr.pdf Effect of Intermetallic and Kirkendall Voids Growth on Board Level Drop Reliability for SnAgCu Lead-free BGA Solder Joint Luhua Xu and John H.L
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