| https://www.eptac.com/faqs/ask-helena-leo/ask/bubbles-in-conformal-coating
. The following has been extrapolated from the J-STD-001 Rev F: 10.3.5 Bubbles and Voids Cured coating should be free of bubbles and voids
Heller Industries Inc. | https://hellerindustries.com/award/2001-smt-vision-award/
! The panel of industry experts concluded that the Gen. 5 system met a significant industry challenge for removing flux from the environment by creatively applying new technology
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
? More SolderTips SolderTip #36: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #37: Through Hole Soldering of Thick PCBs SolderTip #38
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
—the softness of indium makes the surfaces very susceptible to dents, scratches and collecting foreign materials. Any of these incidents can result in voids in the finished sTIM
Heller Industries Inc. | https://hellerindustries.com/thermal/
: Minimizing both nitrogen consumption and oxygen PPM for reflowing in inert atmospheres, to reduce users’ operating costs. Developing the first filter less solution to removing flux condensate from the cooling zone of nitrogen reflow ovens, to virtually eliminate maintenance requirements
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/semiconductor-packaging
. Many manufacturing challenges can be improved or overcome by using a suitable plasma treatment, including improving die attach, increasing wire bond strength, eliminating flip-chip underfill voids
Heller Industries Inc. | https://hellerindustries.com/award/
advancements for the Gen. 5 Flux Separation system on the 1800 EXL-S! The panel of industry experts concluded that the Gen. 5 system met a significant industry challenge for removing flux from the environment by creatively applying new technology. Company Awards
Heller Industries Inc. | https://hellerindustries.com/about/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/award
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
